键合机 meaning in Chinese
wire bonder
Examples
- Design and realization of machine vision system in thermosonic flip - chip bonder
热超声倒装键合机视觉系统的设计与实现 - In addition to improvements in wire bonder hardware , it is necessary to develop a steady wire bonding process which satisfies the requirements for ultra - fine - pitch wire bonding
目前除了需要不断提高键合机硬件性能外，开发满足超细间距引线键合要求且性能稳定的键合工艺十分必要。