铜互连线 meaning in Chinese
copper interconnect
Examples
- The snam results of local stress distribution are in close agreement with the results of computer simulation
利用计算机模拟了温度场变化引起的铜互连线中热应力分布。 - The mechanical simulation compared the stress distribution in copper lines and pore , with the result that the maximum stress locates in the corner
在力学模拟过程中，计算了铜互连线和通孔的热应力的分布。 - Studies on the stress of copper interconnects include the stress measurement by xrd , computer simulation and observation the local stress distribution with snam
利用薄膜应力测试分布仪和xrd测量硅基铜膜及铜互连线薄膜宏观应力。 - On the other hand , tddb experiments of copper interconnection have been taken to prove the performance improvement of interconnect by the use of low - k dielectric
试验方面则进行了铜互连线的tddb试验，来验证低k介质对互连性能的改善。 - Studies on the microstructure of copper interconnects include the determination of grain size by afm and sem , the measurement of texture by xrd and ebsd , the evaluation of barriers by xps and aes
铜互连线的微观结构的研究：通过afm 、 sem 、 tem等的分析方法对铜膜及铜互连线薄膜的晶粒尺寸进行了评价。