钎焊温度 meaning in Chinese
brazing temperature
Examples
- Semiconductor devices - mechanical and climatic test methods - resistance to soldering temperature for through - hole mounted devices
半导体器件.机械和气候试验方法.通孔安装设备的耐钎焊温度 - Semiconductor devices - mechanical and climatic test methods - part 15 : resistance to soldering temperature for through - hole mounted devices
半导体器件.机械和气候试验方法.第15部分:通孔安装设备的耐钎焊温度 - Semiconductor devices - mechanical and climatic test methods - part 15 : resistance to soldering temperature for through - hole mounted devices
半导体装置.机械和气候试验方法.第15部分:通孔安装装置的耐钎焊温度性能 - The analysis results indicate that the correlative influence factors to the technological capabilities of electronic solders include the composition and purity and chemical uniformity of solder alloy , the composition and properties of mother materials and their clean level on the surface , the surface tension of liquid state solders , the temperature and atmosphere in soldering and the activity of flux , the chemical composition and structure and properties of the surface film of melting solders , and so on
分析表明：相关的影响因素主要包括合金的组成、纯度和化学均匀性；母材的成分、性质和表面的洁净度；液态焊料的表面张力；钎焊温度、气氛、助焊剂的活性；液态焊料表面膜的组成、结构和性能等。