裸芯片 meaning in Chinese

bare chip
unpacked chip

Multichip module ( mcm ) is high - level mode in electronic package . mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate . mcm can meet the demands of compact packaging and high density
多芯片组件( mcm )是微电子封装的高级形式，它是把裸芯片与微型元件组装在同一个高密度布线基板上，组成能够完成一定的功能的模块甚至子系统。
Finite element method ( fem ) was used to simulate thermal and vibration problems in stacked - die csp assembly . finite element models and apdl programes were built in ansys to conduct thermal , thermal - mechanical and vibration analysis . the aim of these researches were trying to find some possible reasons and trends which affect the reliability of stacked csp / bga assembly and give some useful suggestions for the packaging design
本论文正是针对以上情况,以采用引线键合工艺的三维叠层csp / bga封装(裸芯片叠装)为研究对象,在有限元分析软件ansys中建立相关的有限元模型,编制了相应的apdl参数化分析程序,进行了温度场分析、热循环加载下的snpb合金焊点疲劳分析和实装pcb板的振动模态分析。