衬底片 meaning in Chinese
substrate slice
Examples
- Slicing and lapping are two basic procedures in wafer substrate process and are introduced firstly in this thesis
切片和研磨工序是硅器件衬底片制备中的两道基本工序。本文首先介绍了这两道工序。 - Heavily as - doped silicon substrates are adopted by many device manufactories because of higher as - doping density . therefore , quantitative determination of oxygen precipitation and induced - defects in heavily as - doped silicon is important to the realization of ig
重掺砷硅衬底片正日益受到器件厂家的青睐，所以研究重掺砷硅单晶中的氧沉淀及诱生缺陷对实现重掺衬底的内吸除有重大意义。