芯片材料 meaning in Chinese

chip material

Up to 100 monitor chips may be employed in a design . chip material and angle of incidence may be separately specified for each individual chip
一个设计中可监视上到100个芯片.芯片材料和入射角可个别指定
Firstly , the influence of reaction time between laser and material on the roughness is studied by changing the speed of laser beam . secondaly , the optimized parameters are found by adjusting laser power and defocus
一方面,通过改变激光加工头的运动速度,考察激光与芯片材料的相互作用时间对侧壁表面粗糙度的影响;另一方面,调整激光的功率和离焦量,找出最优化参数。
Moreover , we give a further discussion on the numerical value calculation of temperature distribution . the main problem when we design the high duty - cycle high power laser diode array we face is the large amount of heat during its operation . so we change the proportion of some ingredients and the concentration of the dopage to gain high quality iii - v material
在激光器阵列的设计过程中，针对大功率激光器严重的产热问题，尤其是高占空比工作时，会有更多的功率转化为热的现象，我们改进芯片材料的配比、掺杂，提出适应高占空比工作的器件版图结构。