芯片封装 meaning in Chinese
fcp
stacked die package
Examples
- Investigation of electroless nickel gold bump technology
芯片封装技术的发展演变 - The development of memory chip package technology
内存芯片封装技术的发展 - The development of chip package technology
芯片封装技术的发展演变 - Development of cpu chip package technology
芯片封装技术的发展演变 - The development of cpu chip package technology
芯片封装技术的发展