组装密度 meaning in Chinese

density packing
packaging density
packing density

Industry standard size , miniature , high density assembly
按工业标准尺寸生产，小型化，组装密度高。
Thick film technology is applied in complex dense electronic assemblies and makes it possible that reduces room occupied and increases mount density in printed circuit board
采用这样的封装能够大大减少占用线路板的空间，进一步提高电路板的组装密度，从而
Electronic device is developing toward lighter , thinner and littler volume , which demands highly on the density and functionality of package i / os . so it is important factor to assure the quality of the solder joint
电子产品的“轻、薄、短、小”化对元器件的微型化和组装密度提出了更高的要求,而焊点的质量和可靠性是影响电子产品质量的重要因素。
With the rapid development of integrate circuit and electronic products various packaging modes and packaging technologies are developed . multi - chip module ( mcm ) packaging technologies rapidly develop because of it ’ s characteristic of improving frequency and increasing transmission speed and so on
多芯片组件( multi - chipmodule即mcm )封装技术因组装密度高,改善了频率特性和传输速度等一系列优点获得了迅速发展。