热循环加载 meaning in Chinese
thermal cycle loading
Examples
- 3 . the anand model , a unified viscoplastic constitutive relation , was applied to represent the nonlinear deformation behavior of 63sn37pb solder
3 .采用anand统一型粘塑性本构模型对63sn37pb焊点钎料在热循环加载下的应力应变进行模拟。 - To our knowledge , for real flip chip packaging under the thermal loading , the paris equation obtained from experiment da / dn and simulation g is firstly reported here , and will be useful practically
本文在热循环加载条件下对实际倒装焊封装给出实验da / dn和模拟g关系的paris方程，属首次报导。 - 2 . the delamination at the interface is one of typical failure mode for electronic packaging . in order to get more understanding of the propagation behaviour of [ he delamination , a series of finite element simulations related were done
为了对界面分层及其传播行为进行深入研究，本文对b型和d型两种实验倒装焊封装，在热循环加载下，进行了有限元模拟。 - Finite element method ( fem ) was used to simulate thermal and vibration problems in stacked - die csp assembly . finite element models and apdl programes were built in ansys to conduct thermal , thermal - mechanical and vibration analysis . the aim of these researches were trying to find some possible reasons and trends which affect the reliability of stacked csp / bga assembly and give some useful suggestions for the packaging design
本论文正是针对以上情况,以采用引线键合工艺的三维叠层csp / bga封装(裸芯片叠装)为研究对象,在有限元分析软件ansys中建立相关的有限元模型,编制了相应的apdl参数化分析程序,进行了温度场分析、热循环加载下的snpb合金焊点疲劳分析和实装pcb板的振动模态分析。