热应力问题 meaning in Chinese
thermal stress problem
Examples
- Dda method of thermal stress problem for jointed rock mass
节理岩体热应力问题的非连续变形分析方法 - In this paper the applications of diamond material to mcm to improve thermal characteristics and thermal stress problem are studied
本文研究了金刚石材料在多芯片组件中热特性改善和热应力问题。 - With increasing of packaging density and power , the technologies of cooling and heat dissipation and thermal stress become important problems to be resolved
随着封装密度和功率的提高,冷却和散热以及由温度引起的热应力问题是必须要考虑的重要技术课题。 - Thermal deformations and stresses of two mental packaging structures made in china and abroad respectively , were investigated by both experimental and numerical methods
本文利用数值计算和实验方法研究了封装的热应力问题，为提高封装的可靠性和优化设计提供理论依据。