溅射工艺 meaning in Chinese
sputtering technology
Examples
- Magnetron sputtering target source and sputtering procedure
磁控溅射靶源设计及溅射工艺研究 - The tcr of the as - deposited films were about 20x10 - 6 /
由优化的溅射工艺参数原位沉积的锰铜薄膜的tcr 。 - The results showed that the sputtering technical parameters have obviously influence on zn / o , the thickness and texture of zno thin film
研究表明,磁控溅射工艺对zno薄膜的锌氧配比、厚度和织构都有很大影响。 - In this paper , several thin films samples of vanadium oxide were got by high - frequency magnetron sputter with pure metal vanadium as sputter source
本文以高纯金属钒作为靶材，采用磁控溅射工艺制备氧化钒薄膜。 - In order to optimize parameters of sputter - depositeing used to manufacture silicon - based tm films in the next step , the dissertation analyses and explains the difference between the two surfaces of sputtered tini film from sputtering factors
为优化溅射工艺参数以用于后续的硅基tini薄膜制备，本文从工艺因素入手，对玻璃基溅射薄膜两个表面的质量差异进行了分析，并给出合理解释。