液封直拉法 meaning in Chinese
lec
liquid encapsulation czochralski process
Examples
- Liquid encapaulated czochralski - grouwn gallium arsenide single crystals and as - cut slices
液封直拉法砷化镓单晶及切割片 - Liquid encapsulated czochralski ( lec ) si - gaas is widely used in the microwave device and the substrates of high speed digital optic - electronic integrated circuits , and it has become one of major materials in information industry
液封直拉法生产的半绝缘砷化镓单晶( lecsi - gaas )被广泛用于微波器件和高频集成电路的衬底材料，成为当代信息产业的重要材料之一。 - In this paper , the author demonstrated the basic principle , development history and characters of high - press liquid - enveloped czochralski method ( leg ) , and its application in producing the gap semi - conductors , at the same time of introducing the general situation of them
本文论述了高压液封直拉法的基本原理、发展历史、特点，该法在半导体材料行业的应用及应用中的影响因素，化合物半导体材料磷化镓的概况、高压液封直拉法在制备该材料时的应用。 - By means of chemical etching , microscope observation , eelectron probe x - ray micro - analyzer ( epma ) , the micro - distribution of c acceptor defect in lec si - gaas wafer is investigated , the results show that there is serious influence of the density and distribution of dislocations on the distribution of c impurity in wafer
本文通过ab腐蚀、 koh腐蚀，金相显微镜观察，透射电镜能谱分析，电子探针x射线微区分析，研究了液封直拉法生长的非掺半绝缘砷化镓( lec ， si - gaas )单晶中碳的微区分布。