材料去除率 meaning in Chinese
material removing rate
Examples
- Material removal rate study of wire electrical discharge machining pocketing
线电极放电铣削凹坑的材料去除率规律研究 - Material removing rate
材料去除率 - The results show that , when increasing the feed rate of the grinding wheel , decreasing the rotating speed of the wafer chuck table and using coarser grit grinding wheel , the material removal rate in the wafer rotating grinding increase , the feed rate of the grinding wheel has greater influence on the material removal rate ; when suitably increasing the rotating speed of the grinding wheel , decreasing the feed rate of the grinding wheel and using finer grit grinding wheel , the wafer surface roughness can be reduced ; there exists a critical rotating speed of the grinding wheel ( about 2300rpm ) , beyond which the material removal rate evidently decreases and the spindle motor current and wafer surface roughness steeply increase ; when the grit size of the grinding wheel is finer than # 2000 , the material removal rate decreases and the wafer surface roughness has no obvious improvement
研究结果表明，增大砂轮轴向进给速度和减小工件转速，采用粗粒度砂轮有利于提高磨削矽片的材料去除率，砂轮轴向进给速度对材料去除率的影响最为显著；适当增大砂轮转速，减小砂轮轴向进给速度，采用细粒度砂轮可以减小磨削表面粗糙度；在其它条件一定的情况下，砂轮速度超过一定值会导致材料去除率减小，主轴电机电流急剧增大，表面粗糙度变差；采用比# 2000粒度更细的砂轮磨削时，材料去除率减小，矽片表面粗糙度没有明显改善。 - By using a wafer - rotating grinding machine , the influence of the main process factors including grit size of diamond grinding wheel , rotating speed of the wafer chuck table , rotating speed and the down feed rate of the cup grinding wheel on the material removal rate , spindle motor current and wafer surface roughness in grinding large size wafer are experimentally investigated
摘要利用基于自旋转磨削原理的矽片超精密磨床，通过试验研究了砂轮粒度、砂轮转速、工件转速及砂轮进给速度等主要因素对材料去除率、砂轮主轴电机电流以及磨削后矽片表面粗糙度的影响关系。 - The stability , rheology , chain structure and consecutive medium model in magnetorheological fluids are analyzed . according to the contribution of shear stress and normal pressure in polishing zone , the quantificational machining model of mrp is presented . as an example of plane workpiece , the influences of machining parameters on removal rate and surface roughness in mrp are studied
5 、磁流变抛光( mrf )是超光滑光学表面的一种新型加工技术，本文从mrf的磁、力学性质出发，研究了磁流液的稳定性、流变效应、链化结构和连续介质模型；根据抛光区内剪应力、正压力的分布特征，提出了mrf的定量加工模型；然后以平面工件的磁流变抛光为例，揭示了工艺参数对材料去除率和表面粗糙度的影响规律。