刻蚀过程 meaning in Chinese

etching process

Etching time has been extended in wet etching course
在电化学刻蚀过程中，需增加循环装置。
In this paper , the development of micro - system is explained . the present research of binary optics and the main methods for shaping are described and some kinds of the methods of etching are compared
本文阐述了微系统的发展过程，叙述了二元光学的研究现状和二元光学的成型过程，比较了几种不同的刻蚀过程方法。
In the section of fabricating technology , i first discuss the ion beam technology . through the analysis of the effects of each parameter on the surface smoothness , profile fidelity and linewidth resolution in the process of ion etching , the suitable angle of incident ion beam , ion energy , density of ion beam and time of etching are selected combining the actual status of the mask
在制作工艺的研究方面，首先研究了离子束刻蚀技术，通过对离子束刻蚀过程中各个参数对刻蚀元件的表面光洁度、轮廓保真度和线宽分辨的影响分析，结合掩膜的实际情况选择出了合适的离子束入射角、离子能量、束流密度和刻蚀时间等参数。