凸起高度 meaning in Chinese

height of projection
hill height

To achieve the required bump heights , the solder paste is over - printed onto the wafer bond pads
为了获得要求的凸起高度，锡膏在晶片焊盘过焊。
Small excursions from the optimally designed aperture size can lead to large bump height variations , which may , in extreme cases , produce open circuits in the assembled chips
跟最佳设计的孔细微的偏差可以导致大的凸起高度变化，它所产生的严重后果是组装件出现“开路” 。