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位错密度 meaning in Chinese

density of dislocations
dislocation concentration
dislocation density
dislocation desity
epd

Examples

  1. Gallium arsenide single crystal - determination of dislocation density
    砷化镓单晶位错密度的测量方法
  2. There exists a strong correlation between initial surface morphology prior to ht growth and ht gan growth mechanism and eventual threading dislocation density in epilayers
    发现高温生长前样品的表面状态对随后生长的gan生长机制及最终外延层中的位错密度有很大影响。
  3. In the relatively high dislocation density areas , dislocations form the relatively small cellular structure and there is few isolated dislocation within each cellular structure . here the profile of c concentration in the dimension of a cellular structure is " u " - shaped . the cell diameter increases as the dislocation density decreases , dislocations form the relatively large cellular structure and there are a few isolated dislocations within each cellular structure
    发现晶片中位错密度和分布严重影响碳的微区分布,高密度位错区,位错形成较小的胞状结构,胞内无孤立位错,碳在单个胞内呈u型分布;较低密度位错区,胞状结构直径较大,胞内存在孤立位错,碳在单个胞内呈w型分布。
  4. We studied the effect of laser quenching ( harden by phase transformation ) on some representative mould steels . through measuring the rigidity on the surface of samples treated by laser heat treatment , and through photographing microstructures of the steel surface , we find many reasons attribute to high hardness . these reasons include ultra - fine grains , high density dislocation and more content of carbon in martensite
    我们研究的是激光淬火对几种典型模具钢的作用,通过对热处理后的试样的硬度分布的测定,用金相和电镜观察金相组织的变化,认为激光热处理产生高硬度的原因是晶粒细化、高的位错密度和高的马氏体含量。
  5. The experimental results showed that firstly , the distribution of resistiveity , mobility , carrier concentration , epd and ab - epd in gaas substrate was not uniform ; secondly , the distribution of electrical parameters depended on that of epd and ab - epd ; thirdly , mesfet devices performance correlated with ab microdefects ; last , as shown by pl mapping results , it is substrate with better parameters quality that could provide more chance to fabricate good mesfet devices
    实验结果表明, lecsi - gaas的电阻率、迁移率、载流子浓度、位错密度和ab微缺陷分布都不是均匀的,且电参数的分布与ab - epd 、位错密度分布有关。制作的mesfet器件的性能参数分布与ab微缺陷有明显联系。从plmapping测量结果可以看出材料的衬底参数好,则pl谱的强度高, pl谱均匀性也好,器件参数也好,就有可能制作出良好的器件与电路。
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Related Words

  1. 位错锚固
  2. 位错猛烈增殖
  3. 位错模式
  4. 位错模型
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