underfill meaning in Chinese
（焊接）未填满（凹陷）
缺肉
填充不足
未充满
未焊满
装填不满
Examples
- Flip chip underfill technology
的芯片倒装技术 - The height and angle of no - flow underfill fillet little effects on the die cracking
在特定的焊点排布下，芯片断裂的可能性会达到最小。 - However , the die cracking was dependent on the young ' s modulus and cte of underfill materials . due to the higher cte and lower
山于薄型芯片在高密度封装使用中越来越广泛，本文的结果对高密度封装设计有重要意义。 - The stress intensity factor ( sif ) and the strain energy release rate were simulated with different pre - crack length for the cases with no - flow underfill and with capillary - flow underfill
本文第六章用断裂力学方涪和有限元模拟分析了填充不流动胶芯片断裂问题，计算了芯片的应力强度因于k和能量释放率g 。 - 2 . the die cracking with no - flow underfill was analyzed during cooling process from the curing temperature of underfill to the room temperature or to the lowest temperature ( - 55 ) in thermal cycle test
近年来，不流动胶倒装焊工艺己开始得到应用，但由于不流动胶的固化温度比常规底充胶高，芯片在冷却过程中将承受更大的热应力。