diametric meaning in Chinese
adj.
1.直径的。
2.正好相反的。
短语和例子
adv.
-cally
Examples
- A dynamic fracture analysis of center - cracked brazilian disc specimens under mixed mode diametric impact loading
径向冲击中心直裂纹巴西圆盘的复合型动态断裂分析 - On the base of the analysis of the static fbd under diametric compression , numerical analysis and compare are performed on the dynamic stress field of the brazilian disk and fbd used in the testing tensile strength under shpb
在对静态平台压缩巴西圆盘( fbd )进行的数值分析的基础上，本文分析了shpb动态劈裂拉伸实验中巴西圆盘和平台巴西圆盘的动态应力场，并对结果进行了比较。 - On the basis of the others , according to the constructional feature of the constitution of the composed soil nails , the computation mode of the he strut frame made of composed soil nails was set up to analyze the distortion of the he strut frame made of composed soil nails when it is stressed . with the engineering data , the strut frame made of composed soil nails is analyzed with the program ababqus , and the effects of the distortion characters , the property of the deposition of the ground , the mechanical property of the soil nails , the variation of the length and the separation of the soil nails , and the diametric of the mixing piles on the strut frame made of composed soil nails , and the distortion property of the strut frame made of composed soil nails under different ground conditions
在总结前人的研究成果下，针对复合土钉墙构造的特点，建立了模拟复合土钉墙受力变形的计算模型，并结合工程实测资料，运用大型通用有限元程序ababqus对复合土钉墙进行了有限元分析，详细讨论了复合土钉支护结构开挖过程中的变形特性、地面沉降性状、土钉受力性状；土钉长度变化、土钉间距变化、搅拌桩桩径变化对复合土钉支护结构的影响；复合土钉支护结构在不同地基条件下的变形特性。 - In the system , the collimation semiconductor laser - scanned beam scanning two perpendiculars direct of one plane of the measured workpiece at the same time is made . the beams with the dimension information of two perpendiculars direct are processed by the scanning receive system , the high - speed photoelectric transition and electronic data process . two measured results of the diametric directs and ellipse tolerance , etc , parameter , of the turning workpiece on the same plane are obtained by non - contact automatic measurement
在单向激光扫描检测技术的基础之上，提出了一种双向激光扫描检测系统，其采用激光扫描检测技术与特殊光学系统相结合，用准直半导体激光扫描光束对被测工件径向某一截面的两个相互垂直方向同时扫描，经扫描接收光学系统、高速光电变换、电子学系统和微机数据处理系统，对将携带有垂直方向被测量信息的光束进行处理，实现了回转体工件同一截面两个垂直方向的径向尺寸和椭圆度等参数的非接触自动测量，解决了同时非接触测量回转体零件同一截面两个径向尺寸的难题，它具有高速，高精度和非接触自动测量等特点。