bondline meaning in Chinese

结合面温度

In the model , the temperature distribution with different process parameters is simulated and the bondline width is obtained
本文利用有限元法建立了移动高斯热源作用下硅玻璃激光键合的三维温度场数值分析模型。
The numerical modeling results show that the smaller the elastic modulus of adhesive in fillet , the higher the peak stress in adhesive layer at the adjacent point to the fillet when hi - adhesives used to form the fillet and bondline respectively and is higher than that of the joint made of single adhesive
结果表明，当胶瘤采用不同于胶层的胶粘剂时，随着胶瘤弹性模量的减小，在胶层与胶瘤的连接处胶层中应力峰值显著提高，且均高于由单一胶所形成接头的应力峰值。