| 1. | Mosquitoes lay thir eggs in stagnant pools of water
（蚊虫在不流动的池水里产卵。 ） |
| 2. | Non - liquid saturated treatment systems
不流动饱和处理系统 |
| 3. | It is always stuck or non - moving energy flow that will lead to disease
阻滞或者不流动的能量流总是将带来疾病。 |
| 4. | Somewhere , something is ) stagnant , and dark ) shadows are gathering
某处，某事是)不流动的,和黑暗)图像正在聚集) 。 |
| 5. | Securities lending allows temporarily illiquid securities to be loaned to investors
债券借贷将本来暂时不流动的债券出借给需要债券的投资者。 |
| 6. | Accumulators ; tests ; sealed lead storage batteries with grid type plates and immobilized electrolyte , maintenance free ; test methods
蓄电池.试验.采用栅极板和不流动电解液的免维护密封 |
| 7. | The stress intensity factor ( sif ) and the strain energy release rate were simulated with different pre - crack length for the cases with no - flow underfill and with capillary - flow underfill
本文第六章用断裂力学方涪和有限元模拟分析了填充不流动胶芯片断裂问题，计算了芯片的应力强度因于k和能量释放率g 。 |
| 8. | 2 . the die cracking with no - flow underfill was analyzed during cooling process from the curing temperature of underfill to the room temperature or to the lowest temperature ( - 55 ) in thermal cycle test
近年来，不流动胶倒装焊工艺己开始得到应用，但由于不流动胶的固化温度比常规底充胶高，芯片在冷却过程中将承受更大的热应力。 |
| 9. | The cracking with these two types of underfill might become unstable and lead to catastrophic failure at the end . the critical length was about 12m for the assembly with no - flow underfill and 20m for the package with capillary - flow underfill at 20 ?
模拟表明，山固化温度冷却到室温时，所研究的倒装焊封装在填充不流动胶时芯片断裂临界裂纹长度为12pm ，而填充传统底充胶时为20hm 。 |
| 10. | In the second part , the reliability research on electronic packaging was concentrated with finite element method ( fem ) on moisture diffusion in plastic materials , die cracking of flip - chip with no - flow underfill and thermal performance of high power electronic components . in the last chapter , the design tool for advanced electronic package was studied . the main conclusions in the second part are as follows
论文第二部分电子封装可靠性研究包含对塑封材料中水汽扩散研究、填充不流动胶的倒装焊芯片可靠性研究以及大功率器件散热问题研究三方面内容，最后为实现封装设计标准化和自动化，研究了若干最主要的电子封装构型的参数化有限元建模、加载和相应的求解方法。 |
