| 1. | General requirements for workmanship of surface mount technology
表面组装工艺通用技术要求 |
| 2. | Terminology for surface mount technology
表面组装技术术语 |
| 3. | Mixed component mounting technology
混合零件之组装技术 |
| 4. | Surface mounting technology smt
面贴装生产 |
| 5. | Surface mount technology , smt
表面黏着技术 |
| 6. | Surface mounting technology
表面贴装技术 |
| 7. | Ic and optoelectronics packaging ; flip chip technology ; surface mount technology
集成电路及光电子封装；倒扣芯片技术；表面贴装技术 |
| 8. | Standard surface - mount technology or through - hole techniques provide adequate performance
标准表面贴装技术或通孔技术提供足够的性能。 |
| 9. | Smds surface mounting technology - standard method for the specification of surface mounting components
表面安装技术.第1部分:表面安装元件 |
| 10. | Smds surface mounting technology - part 1 : standard method for the specification of surface mounting components
表面安装技术第1部分：表面安装元器件 |
