| 1. | A study on cure reaction of bmi diamine liquid crystalline epoxy
液晶环氧体系固化研究 |
| 2. | Study on curing reactions and application of e - 44 epoxy resin
44型环氧树脂固化和应用的研究 |
| 3. | Study on curing reaction of epoxy resin and phthalazinone curing agent
含二氮杂萘酮环氧树脂体系的固化反应动力学研究 |
| 4. | Structure and property of co - curing reaction product for epoxy and cyanate resin system
环氧树脂与氰酸酯共固化物的结构与性能 |
| 5. | Studies on the preparation and curing reaction kinetics of phenolic resin montmorillonite nanocomposite
蒙脱土纳米复合材料的制备及固化反应动力学研究 |
| 6. | The ft - ir results show organic montmorillonite has inhibition to the curing reaction of unsaturated polyester
Ft - ir的结果表明有机蒙脱土的加入对不饱和聚酯树脂的固化反应有一定的阻聚作用。 |
| 7. | Two pack enamels will harden at room temperature . since the curing reaction stops when the hardener has completed reaction with the base resin , they do not go brittle with age
双套瓷釉在室温下也能硬化。硬化剂反应完成时修复反应也停止了，他们不会随老化变的脆弱。 |
| 8. | This article presents a review of the chemorheology during the curing reaction of thermosetting resins . two different approaches in modeling the chemovisity of thermosetting resins are briefly described
摘要本文讨论了热固性树脂固化时化学流变性问题，并通过两种途径模拟了热固性树脂的化学粘度。 |
| 9. | The main results are summarized as follows : first , formulation tailoring and curing process of epoxy resin adhesive have been studied , and the peel strengths were tested . the curing temperatures are obtained following the result of curing reaction heat flow tested by dsc
主要研究内容和结果如下:首先,研究了作为基底材料基体的环氧树脂胶粘剂的配方,利用差示扫描量热仪( dsc )确定了胶粘剂的固化温度,并对胶粘剂进行了性能测试。 |
| 10. | The curing kinetics parameters of up with lwt % organic montmorillonite were determined by the dynamic dsc . its apparent activation energy is higher than pure up ' s , but reaction order is similar . these results show the addition of organic montmorillonite increase difficulty degree of curing reaction
采用非等温dsc法计算出的含有机蒙脱土1wt的不饱和聚酯树脂的表观反应活化能和固化温度高于不饱和聚酯树脂，但反应级数基本没有变化，说明加入有机蒙脱土使树脂的固化反应难度增大。 |
