| 5. | Mainly for capacitance , semiconductor , jingzhen , resistance , ic chips , jiechajian procedures , connecting pieces , switching devices , silicon , triode , diode , piezoelectric ceramic base films , tubes , electron tubes , electronic stamping , precision metal parts , production processes between cleansing processes 芯片接插件连接件转接器硅片三极管二极管压电陶瓷基片显象管电真空器件等内精密电子冲压五金零件,生产加工过程工序间的清洗。 |