| 1. | Cause of multilayer printed board ' s warp and the countermeasure
多层印制电路板翘曲成因与对策 |
| 2. | Test methods of prepreg for multilayer printed wiring boards
多层印制电路板用半固化片的试验方法 |
| 3. | General rules of prepreg for multilayer printed wiring boards
多层印制电路板用半固化片的通用规则 |
| 4. | Specification for base materials for rigid and multi - layer printed boards
刚性多层印制电路板基材规范 |
| 5. | Sectional specification : multilayer printed boards ; german version en 123300 : 1992
分规范.多层印制电路板 |
| 6. | Specification for base materials for rigid and multilayer printed boards
硬质多层印制电路板基底材料的规范 |
| 7. | Multilayer printed wiring boards
多层印制电路板 |
| 8. | Mulitlayer printed circuit board
多层印制电路板 |
| 9. | Sectional specification : multilayer printed boards ; german version en 123300 : 1992 a1 : 1995
分规范:多层印制电路板 |
| 10. | Multilayer printed board ml
多层印制电路板 |
