| 1. | Passive integration technology and application of low temperature co - fired ceramic
低温共烧陶瓷无源集成技术及其应用 |
| 2. | At the end of the paper , a layout of a multilayer co - firing ceramics filter drawn by the software was given out
论文最后利用该软件画了一个多层共烧陶瓷滤波器的版图。 |
| 3. | Low sheet resistance and good matching between substrate and paste are the principal requirements for conductor paste in multi - layer cofire substrate
共烧导带浆料与aln生坯之间的烧结应力是造成基板失效的原因。 |
| 4. | We need to start their sintering at same temperature and to ensure conductor paste and green - sheet ceramic bodies have the same shrinkage rate
为了消除二者之间的烧结应力，共烧导带浆料与aln生坯必须同时进入烧结状态，具有相同的收缩特性。 |
| 5. | A bandpass filter which is suitable to be implemented using a multilayered structure , including multilayer ceramic / low temperature co - fired ceramic ( mlc / ltcc ) technique , is presented
一种利用多层结构技术，包括多层陶瓷?低温共烧陶瓷（ mlc / ltcc ） ，完成的带通滤波器。 |
| 6. | This experiment was deposited piezoelectric thick film which useprinting on the silicon chip and low - temperature sinter , makepiezoelectric thick film and silicon chip structure more denser
摘要本文是将压电厚膜利用网印的方法沉积在矽晶片上，同时使用低温共烧的方式，使得压电厚膜与矽晶片更加的警密结合。 |
| 7. | This experiment was deposited piezoelectric thick film which useprinting on the silicon chip and low - temperature sinter , makepiezoelectric thick film and silicon chip structure more denser
摘要本文是将压电厚膜利用网印的方法沉积在硅芯片上，同时使用低温共烧的方式，使得压电厚膜与硅芯片更加的警密结合。 |
| 8. | The process of organic vehicle evacuation of aln green tape and ag conductor paste have been researched in the view of ltcc technology , and optimum condition of organic vehicle evacuation temperature and cofiring atmosphere have been determined
摘要从低温共烧的工艺角度来研究氮化铝坯片和银浆的排胶，从而确立排胶的温度及烧结气氛的控制。 |
| 9. | A1n grains at interface are no different from those in the bulk . the sintering stress is decreased to the degree that cannot influence the substrate shrinkage . the a1n substrate contains nine levels with size of 50 50mm2
经过实验，发现sio _ 2含量在0 . 45质量分数时，浆料与基板之间能够满足匹配性要求，烧结应力小， aln共烧基板能够达到足够的致密度和平整度。 |
| 10. | To match the ltcc technique and the request of high frequency components , microwave dielectric ceramics are developing to high frequency and low singtering temperature . casio3 system ceramic is an excellent low dielectric constant and high frequency microwave dielectric material
Casio _ 3体系陶瓷是一种良好的低介高频微波介质材料，但是其烧结温度高，难以在1000以下与ag 、 cu等低熔点电极材料共烧。 |
