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芯片结构 meaning in English

chip architecture

Examples

  1. In this paper , the features of a dsp system is introduced following the introduction of dsp chips " development history , applications and structure
    本文首先介绍了dsp的发展和应用,接着对dsp芯片结构以及系统特点作了介绍。
  2. The technics of two kinds of thin film gas sensors made by powder sputtering are introduced . the structure and the experimental results of basic parameters are given in this paper
    摘要介绍了用粉末溅射做出的两种平面薄膜型酒敏元件的工艺、芯片结构和基本参数测试的结果。
  3. Abstract : various factors affecting the yield of packaging process of high speed switching diodes were analyzed on die structure and packaging process of devices , and steps have been taken to improve the yield of the dioldes
    摘要:从器件的芯片结构及封焊工艺入手,分析了封焊工艺影响成品率的各种原因,并采取相应的改进措施,提高了器件的成品率。
  4. Then , the author specially studies the characteristic of system architecture of the dsp , paints schematic principle diagram and pcb diagram of the hardware circuit system , writes the program decoding and partial data processing of the cpld , adopting verilog hdl hardware describing language
    然后,研究了dsp芯片结构体系的特点,绘制了硬件电路系统的原理图和pcb图,且采用veriloghdl硬件描述语言编写了复杂可编程逻辑器件( cpld )的译码与部分数据处理程序。
  5. In chapter three , briefly introduce the hardware design of a collection system of traffic information , all kinds of projects which may be used in current or future data compression , especially soc sopc and multimedia processor , are analyzed and compared in detail . considering the feasibility of current technology and product cost , the module of data compression is put forth
    第三章简要介绍了整个系统的硬件设计方案,对当前及将来可能用于压缩模块中的各种软硬件实施方案作了深入的比较和分析,特别是soc和sopc思想以及当前流行的多媒体芯片结构对于今后系统设计的影响;就当前的技术可行性以及实际产品成本提出了压缩模块的最终实施方案。
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Related Words

  1. 磊芯片
  2. 晶体管芯片
  3. 芯片处理
  4. 芯片编号
  5. 芯片数量
  6. 芯片粘贴
  7. 测试芯片
  8. 微芯片
  9. 芯片操作系统
  10. 性格芯片
  11. 芯片键合用粘合剂
  12. 芯片接合
  13. 芯片解码器
  14. 芯片巨头
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