管壳封装 meaning in English
case of package
case package
Examples
- Subsequently , we can get the chip s - parameter by adding the negative equipment circuit of the parasitic parameters in the s - parameter model of packaged device
之后，在有管壳封装器件的s参数模型中，加上负的寄生参量的等效电路，即可得到管芯的s参数。 - For designing the microwave power amplifier formed by the chip of sige hbt more accurately , an novel method to extract chip s - parameter from s - parameter of packaged device with package is proposed
为了更精确设计由sige异质结晶体管( hbt )管芯构成的微波功率放大器，本论文提出了一种新颖的从管壳封装器件的s参数中提取出管芯s参数方法。 - First we measured s - parameter of the device and package shell . the package shell and bonding wire are expressed with equipment circuit composed of the resistance , capacitance and inductance then acquired the value of component by optimizing using microwave emulation software ( microwave office )
首先，测量出管壳封装器件和管壳的s参数，把管壳和键合线均表示为由电容、电感、电阻组成的等效电路，再用微波仿真软件( microwaveoffice )优化出元件数值。