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研磨工序 meaning in English

grinding stage

Examples

  1. Slicing and lapping are two basic procedures in wafer substrate process and are introduced firstly in this thesis
    切片和研磨工序是硅器件衬底片制备中的两道基本工序。本文首先介绍了这两道工序。

Related Words

  1. 最后工序做得很细致的家具
  2. 研磨段
  3. 碎研磨
  4. 研磨斑痕
  5. 研磨速度
  6. 冷研磨
  7. 车床研磨
  8. 闭路研磨
  9. 研磨角度
  10. 研磨石
  11. 研磨工具
  12. 研磨工人
  13. 研磨过程
  14. 研磨过的
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