焊球 meaning in English

bead, solder
soldered ball
torch head
welded ball
weldedball

Bga transform and insulating substrate technology
焊球阵列转变与绝缘基板技术
Specification for solderability tester by globule method
焊球法可焊性测试仪.技术条件
Test methods for bare wires - solderability test of coating - solder globule method
裸电线试验方法镀层可焊性试验焊球法
In the five key factors of solder ball alloy , solder paste alloy , peak temperature , the time above liquidus and soldering environment , the fore four factors are more important than soldering environment to the solder joints reliability
在焊球合金、焊料合金、峰值温度、液相线以上时间和焊接环境五个关键因素中，前四项对焊点可靠性比较重要，焊接环境对焊点可靠性的影响不很显著。
Third , it analyzes different influences upon the life predication by comparing different models of the same package , different constitutive models of the same solder ball ' s materials , different life prediction models , different solder ball dimensions , different mesh density etc . finally , it compares some popular constitutive models of the solder ball materials , and constructs an integrated constitutive model by different curve fits
接着，又在上述分析的基础上，比较了同种封装的不同模型(如条形模型， 1 4模型， 1 8模型) 、相同焊球材料的不同本构模型、不同寿命预测模型、不同焊球尺寸及网格密度等方面对寿命预测的影响。