半导体器件制造 meaning in English
semiconductor device fabrication
semiconductor fabrication
Examples
- Manufactures electric devices ranging from crystal oscillators and lcds to srams and asics
-是集研发生产和销售为一体的半导体器件制造企业。 - Test methods for determining the combustability characteristics of plastics used in semi - conductor tool construction
半导体器件制造用塑料可燃性特征测定的试验方法 - In the manufacture of semiconductor devices , a photographically reduced representation of a circuit or element as used to establish an etching pattern
在半导体器件制造中,以缩小的照相方式表示的电路或元件,用于建立刻蚀图案。 - Abstract : the process defect , minor defect and key precess , their impact on quality and reliability , and the control method are introduced . the kdy control points , the parameter control scope and the requirement of process environment for high quality and reliability device are discussed
摘要：重点介绍了国内外半导体器件制造工艺与器件可靠性的相关性报道：缺陷、微缺陷、关键工艺对器件质量和可靠性的影响及其控制方法；还介绍了关键工艺控制点的确定及其参数控制范围以及生产高质量、高可靠性器件的工艺环境的控制要求。 - With the development of vlsi ( very large scale integration ) and ulsi ( ultra large scale integration ) , rtp ( rapid thermal process ) , which consumes less time and less energy than classical thermal treatments , have been widely employed in semiconductor manufacturing . however , the most importance is that rtp is applied for defects engineering of silicon material . it is generally believed the rtf leads to the injection of additional vacancies into silicon wafer , and then a so - called magic denuded zone ( mdz ) in the near - surface region of cz silicon wafer was formed by controlling the vacancy distribution
随着大规模集成电路( vlsi )和超大规模集成电路的发展，节省时间、节省能量、容易控制的快速热退火工艺在半导体器件制造工艺中得到了广泛的应用，并且在硅材料的缺陷工程中发挥了特殊的作用，人们通过高温快速热处理在硅片中引入空位，并控制空位的分布，进而形成了具有较强内吸杂能力的洁净区。